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DATACON 2200 evo. Install Debian Linux. The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications.

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DATACON 2200 evo The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. Equipped with integrated dispenser, 12” wafer handling, automatic tool changer, and application specific tooling, the Datacon 2200 evo is prepared for present and future processes and products.

More info on: DATACON 2200 evo plus The Datacon 2200 evo plus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership. Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities. ESEC 2100 xP PLUS The Die Bonder Esec 2100 xP plus is the the 2 ndgeneration of the most flexible 300 mm high speed platform, capable of running the full range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA. It is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership. At its introduction, this innovative platform was awarded with the prestigious Swiss Technology Award. FINEPLACER® femto 2 Automated sub-micron Die Bonder The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications in a controlled environment.

Depending on the requirements, the modular FINEPLACER® femto 2 can be individually configured and retrofitted at any time to support new applications and technologies. This makes the system a perfect tool and reliable companion as applications migrate from product development to production. Bobcad Cam V21 Keygen Generator. It covers the entire workflow of inspection, characterization, packaging, final test and qualification in semiconductor, communications, medical and sensor technologies.